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Low Dielectric Adhesive - List of Manufacturers, Suppliers, Companies and Products

Low Dielectric Adhesive Product List

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Low dielectric adhesive AF-700 film type for electronic materials/substrates

Low dielectric adhesive AF-700 film type for electronic materials/substrates

Aromite AF-700 ◆ A bonding film that combines top-class low dielectric properties and excellent adhesion in the industry. Ideal for bonding high-speed transmission substrate materials!

The "Aromite(R) AF-700 series" is a thermosetting bonding film that exhibits low dielectric properties in the high-frequency range (1-10GHz). Compared to conventional epoxy-based bonding films, it has lower dielectric constant and dielectric loss tangent, making it suitable for electronic material applications that require high frequency performance. It has good adhesion to substrates that are generally considered difficult to bond, such as polyimide and LCP, and also excels in processability during circuit board manufacturing. It has received high praise from circuit board material manufacturers and film manufacturers both domestically and internationally. It is used in mobile circuit boards, including smartphones, as well as in automotive millimeter-wave radar and antenna components for base stations.

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Low dielectric adhesive "ZLP"

Low dielectric adhesive "ZLP"

Reduce transmission loss with high-speed communication FPC! Thermosetting adhesive sheet that can be stored at room temperature.

"ZLP" is a low-dielectric adhesive material available in adhesive sheet form, which can be bonded with various materials such as copper and polyimide. It is a thermosetting adhesive sheet that can be stored at room temperature, and there are two bonding methods: "roll lamination method" and "sheet quick press method." Due to its low dielectric constant and low dielectric loss tangent, it can reduce transmission loss in high-speed communication FPCs. [Adhesive Curing Conditions] ■ Oven Cure (without pressure): 180°C × 90 min at atmospheric pressure ■ Press Cure (with pressure): 180°C × 90 min at 2.0 MPa *For more details, please refer to the PDF document or feel free to contact us.

  • Other polymer materials
  • Other consumables

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